Development of Electroless Ni Plating Bath Using Ti (III) Ion Reductant.
نویسندگان
چکیده
منابع مشابه
Electroless Nickel Plating: Bath Control
In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 2002
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.53.694